Surface Mount Technology

We are equipped with a Philips (Assembleon) CSM84V Automated Pick and Place component mounter. This CSM platform with three mounting heads reaches speeds up to 6500 components per hour and has a component range of 0402 chip components, QFP packages from 50mm with minimum lead pitch of 0.3mm (12mil). Accompanying our Fine Pitch Placer is a Philips Comet II high speed component mounter. This system features a twin head gantry with 16 nozzles per head, which delivers over 15,000 SMDs/Hour. It also has full “in flight” visual alignment ranging down to 0402.  This system accommodates up to 112 feeders allowing for a wide mix of board designs.

Our Philips Powerline platform is complemented with a Research International 4470MP Forced Air/IR  Convection Reflow Oven with edge hold conveyor for pure double sided SMT processing applications.

Mixed Tech PCB's

SAK Technologies meets production needs for Mixed and Plated Through Hole technology PCB printed circuit board assemblies. All production hardware is profiled to suit each individual configuration.

We utilize volume production methods to assemble your product as efficiently as possible. We perform 100% inspection and all appropriate ESD precautions are adhered to when handling hardware. Inspection and handling requirements are in accordance with; IPC-610D, Class 3.